Thermal resistance values

Reference example (HSOP-8A)

Item		Specification
Size		114.3 mm x 76.2 mm x t1.6 mm
Material		FR-4
Number of copper foil layer		2
Copper foil layer	1	Land pattern and wiring for testing : t0.070 mm
	2	-
	3	-
	4	74.2 mm x 74.2 mm x t0.070 mm
Thermal via		-

Reference example (HSOP-8A)

Item		Specification
Size		114.3 mm x 76.2 mm x t1.6 mm
Material		FR-4
Number of copper foil layer		4
Copper foil layer	1	Land pattern and wiring for testing : t0.070 mm
	2	74.2 mm x 74.2 mm x t0.035 mm
	3	74.2 mm x 74.2 mm x t0.035 mm
	4	74.2 mm x 74.2 mm x t0.070 mm
Thermal via		-

 

Reference example (HSOP-8A)

Item		Specification
Size		114.3 mm x 76.2 mm x t1.6 mm
Material		FR-4
Number of copper foil layer		4
Copper foil layer	1	Land pattern and wiring for testing : t0.070 mm
	2	74.2 mm x 74.2 mm x t0.035 mm
	3	74.2 mm x 74.2 mm x t0.035 mm
	4	74.2 mm x 74.2 mm x t0.070 mm
Thermal via		Number: 4 Diameter: 0.3 mm

 

Reference example (HSOP-8A)

Item		Specification
Size		114.3 mm x 76.2 mm x t1.6 mm
Material		FR-4
Number of copper foil layer		4
Copper foil layer	1	Land pattern and wiring for testing : 45 mm x 50 mm x t0.070 mm
	2	74.2 mm x 74.2 mm x t0.035 mm
	3	74.2 mm x 74.2 mm x t0.035 mm
	4	74.2 mm x 74.2 mm x t0.070 mm
Thermal via		-

 

Reference example (HSOP-8A)

Item		Specification
Size		114.3 mm x 76.2 mm x t1.6 mm
Material		FR-4
Number of copper foil layer		4
Copper foil layer	1	Land pattern and wiring for testing : 45 mm x 50 mm x t0.070 mm
	2	74.2 mm x 74.2 mm x t0.035 mm
	3	74.2 mm x 74.2 mm x t0.035 mm
	4	74.2 mm x 74.2 mm x t0.070 mm
Thermal via		Number: 4 Diameter: 0.3 mm