Resistance to soldering heat condition for Package

Reflow soldering

The amount of heat received in the reflow oven depends on the package resin, lead, solder material, PCB, etc. If the temperature of lead part or PCB surface is used to determine the reflow temperature, a package crack may occur since the package surface temperature is normally higher than that of the lead part or PCB surface. The reflow profile shown below was used by us to evaluate the heat resistance of the package. In order to perform similar evaluations, check the package surface temperature before setting the temperature profile. 
The following figure is an example of a standard package. The figure may change with packages. Please contact our sales office for details.

Resistance to soldering heat condition for Package( Reflow method)
Resistance to soldering heat condition for Package( Reflow method)

Remark 
1. Temperature measurement point: Package upper surface (Resin surface) 
2. Number of maximum reflow cycles: Three times

Flow soldering

Flow soldering gives larger thermal stress to IC chips compared to reflow soldering. Preheating is indispensable to relax the thermal stress. The following figure is an example of a standard package. The figure may change with packages. Please contact our sales office for details.

Resistance to soldering heat condition for Package( Flow method)
Resistance to soldering heat condition for Package( Flow method)

Remark 
1. Temperature measurement point: Solder joints
2. Number of maximum reflow cycles: Once