FAQ Frequently Asked Questions

[Product Reliability] How is the product life judged?

Acceleration tests, which are included in periodic reliability tests, are performed for a time equivalent to the product life, to judge the endurance of the product.
Voltage acceleration and temperature acceleration are included in the acceleration tests. ABLIC adopts temperature acceleration tests based on the Arrhenius model.
The acceleration factor conforms to JEITA standard EIAJ ED-4701 and is calculated by the following formula.

(Acceleration factor calculation formula) L = exp(Ea/kT2)/exp(Ea/kT1)
L: Acceleration factor
Ea: Energy of activation
k: Boltzmann coefficient
T2: Actual use temperature (absolute temperature)
T1: Acceleration test temperature (absolute temperature)

Specifically, the following conditions are substituted.
Energy of activation 0.5 eV
Boltzmann coefficient 8.617 × 10-5 eV/K
Actual use temperature 40°C
As a result of the above substitution, the acceleration factor at 125°C is shown to be 52 times that at 40°C. In sum,
1,000 hours are equivalent to 5.9 years
2,000 hours are equivalent to 11.8 years.

As shown above, successfully performing reliability tests at 125°C for 2,000 hours assures that the product life is judged to be at least 10 years at the actual use temperature.

[Package] Does the mold resin contain phosphorus?

Inorganic phosphorus is not used in ABLIC products. Organic phosphorus is used in some packages as a resin hardness accelerator.

[Package] Can packages be used when the power dissipation is momentarily exceeded due to rush current?

The power dissipation is the average power per second.
Packages can be used when the average power is within the power dissipation range, even if a large current momentarily flows due to rush current.

[Package] How should the potential of a radiation pad on the rear of a package be kept constant?
HSON(A), SNB(B), SON(B), PLP

Radiation pads on the rear side are affixed to the IC die substrate via silver paste (conductive paste). Radiation pads, therefore, must be used with the potential of the pads being the same as that of the IC die substrate or floating.

*Caution Radiation pads cannot be used as electrodes.

Product Name Subject Package Name Potential of Radiation Pad
S-1131 6-pin HSON(A) VSS or open
S-1170 6-pin HSON(A) VSS or open
S-8355/56/57/58 6-pin SNB(B) VOUT (VDD for VDD separate type) or open
S-8821 6-pin SNB(B) VSS or open
S-8261 6-pin SNB(B) VDD or open
S-8242 6-pin SNB(B) VDD or open
S-8424A 8-pin SON(B) VSS or open
S-8425 8-pin SON(B) VSS or open
S-83M355/356 PLP-8B See the data sheet.
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