Thermal resistance values

Thermal resistance values

Board A

Reference example (HSOP-8A) Type A:Reference example(HSOP-8A)

Item Specification
Size 114.3 mm x 76.2 mm x t1.6 mm
Material FR-4
Number of copper foil layer 2
Copper foil layer 1 Land pattern and wiring for testing : t0.070 mm
2
3
4 74.2 mm x 74.2 mm x t0.070 mm
Thermal via

 

Board B

Reference example (HSOP-8A) Type A:Reference example(HSOP-8A)

Item Specification
Size 114.3 mm x 76.2 mm x t1.6 mm
Material FR-4
Number of copper foil layer 4
Copper foil layer 1 Land pattern and wiring for testing : t0.070 mm
2 74.2 mm x 74.2 mm x t0.035 mm
3 74.2 mm x 74.2 mm x t0.035 mm
4 74.2 mm x 74.2 mm x t0.070 mm
Thermal via

 

 

Board C

Reference example (HSOP-8A) Type C

Item Specification
Size 114.3 mm x 76.2 mm x t1.6 mm
Material FR-4
Number of copper foil layer 4
Copper foil layer 1 Land pattern and wiring for testing : t0.070 mm
2 74.2 mm x 74.2 mm x t0.035 mm
3 74.2 mm x 74.2 mm x t0.035 mm
4 74.2 mm x 74.2 mm x t0.070 mm
Thermal via Number: 4 Diameter: 0.3 mm

 

 

Board D

Reference example (HSOP-8A) Type D

Item Specification
Size 114.3 mm x 76.2 mm x t1.6 mm
Material FR-4
Number of copper foil layer 4
Copper foil layer 1 Land pattern and wiring for testing : 45 mm x 50 mm x t0.070 mm
2 74.2 mm x 74.2 mm x t0.035 mm
3 74.2 mm x 74.2 mm x t0.035 mm
4 74.2 mm x 74.2 mm x t0.070 mm
Thermal via

 

 

Board E

Reference example (HSOP-8A) Type E:Reference example(HSOP-8A)

Item Specification
Size 114.3 mm x 76.2 mm x t1.6 mm
Material FR-4
Number of copper foil layer 4
Copper foil layer 1 Land pattern and wiring for testing : 45 mm x 50 mm x t0.070 mm
2 74.2 mm x 74.2 mm x t0.035 mm
3 74.2 mm x 74.2 mm x t0.035 mm
4 74.2 mm x 74.2 mm x t0.070 mm
Thermal via Number: 4 Diameter: 0.3 mm